Safer materials advisor: Identification and characterization of materials of concerns
- Viviane T. Silva
- Kristin Schmidt
- et al.
- 2026
- ACS Spring 2026
Poster
Curtis Grosskopf
Title
STSM - Supply Chain Engr, Components: IC Packaging, Pkg/PWB interaction, RoHS issues, JEDEC JC14.4 chair
Bio
Senior Technical Staff Member, IBM Supply Chain Engineering, -35+ years IC packaging and electronic component assembly -2nd level interaction between electronic components and PWB assembly processes
- Technical lead for IBM Supply Chain Engineering team for environmental (RoHS, REACH, PFAS, etc.) and Pb-free issues
- Chairman JEDEC JC14.4 - Quality Systems
- Co-chair IPC 2-15f - Obsolete and Discontinued Products
- 35+ years involvement in generation of IPC and JEDEC industry standards
Publications
Patents
- US
- 11120381
- US
- 10141703
- US
- 9972957
- US
- 9966719
- US
- 9563739
- US
- 9317643
Projects
Finding AI-based solutions to address challenges around materials of concern and their replacement.
Top collaborators
DB
Dave Braines
CTO Emerging Technology, IBM Research, UK
TE
Tim Erdmann
Staff Research Scientist
BR
Brandi Ransom
Research Scientist
KS
Kristin Schmidt
Strategy Assistant for Algorithms & Applications, Lead of Safer Materials Advisor