Microscopy and Microanalysis

Paper

01 Aug 2002

A comparison of grain size measurements in Al-Cu thin films: Imaging verses diffraction techniques

Abstract

No abstract available.

Paper

Linewidth and underlayer influence on texture in submicrometer-wide Al and AlCu lines

J.L. Hurd, K.P. Rodbell, et al.

Applied Physics Letters

Conference paper

Several issues regarding the nanopore structure in low-dielectric-constant films detected by positron annihilation lifetime spectroscopy

C.L. Wang, M.H. Weber, et al.

Radiation Physics and Chemistry

Paper

Effect of copper on the microstructure and electromigration lifetime of Ti-AlCu-Ti fine lines in the presence of tungsten diffusion barriers

A. Domenicucci, R. Filippi, et al.

Journal of Applied Physics

Paper

A Ge_xSe_1-x switch-only-memory technology through polarized atomic distribution

Zhi-Lun Liu, Alexander Grun, et al.

Scientific Reports

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