C.C. Williams, J. Slinkman, et al.
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
We describe a new type of jet plating that uses a focused high-frequency sound field directed through the center of the jet. The acoustic jet results in an improved morphology for gold and copper depositions although plating rates are not enhanced. Four-point probe measurements of acoustic-jet plated copper lines show up to a 50% decrease in electrical resistivity compared to jet plated deposits.
C.C. Williams, J. Slinkman, et al.
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
R.J. Von Gutfeld, R.T. Hodgson
Applied Physics Letters
P.A. Moskowitz, D.R. Vigliotti, et al.
CLEO 1983
C.C. Williams, H.K. Wickramasinghe
Journal of Applied Physics