Conference paper
SOME BASIC PROBLEMS IN VLSI INTERCONNECT.
P.S. Ho
ECS Meeting 1984
A stretch deformation method has been developed for quantitative study of adhesion and deformation of metal/polymer structures. The adhesion energy is directly measured from the difference in the load versus elongation curves between film/substrate and substrate structures. This method has been applied to study structures formed with Cu, Cr, and Cu/Cr deposited on pyromellitic dianhydride-oxydianiline polyimide. The importance of crack formation in the metal layer for initiating interfacial delamination is demonstrated.
P.S. Ho
ECS Meeting 1984
R.J. Purtell, P.S. Ho, et al.
Physica B+C
P.S. Ho, P.O. Hahn, et al.
JVSTA
P.S. Ho, J.E. Lewis
Surface Science