Rajiv Ramaswami, Kumar N. Sivarajan
IEEE/ACM Transactions on Networking
The paper reviews our recent progress and current challenges in implementing advanced gate stacks composed of high-κ dielectric materials and metal gates in mainstream Si CMOS technology. In particular, we address stacks of doped polySi gate electrodes on ultrathin layers of high-κ dielectrics, dual-workfunction metal-gate technology, and fully silicided gates. Materials and device characterization, processing, and integration issues are discussed. © Copyright 2006 by International Business Machines Corporation.
Rajiv Ramaswami, Kumar N. Sivarajan
IEEE/ACM Transactions on Networking
Robert G. Farrell, Catalina M. Danis, et al.
RecSys 2012
Nanda Kambhatla
ACL 2004
Matthias Kaiserswerth
IEEE/ACM Transactions on Networking