Joy Y. Cheng, Daniel P. Sanders, et al.
SPIE Advanced Lithography 2008
Vacancy jumps in a bicrystal model of Σ = 5 (36.9°) [001] tilt boundary in aluminum have been observed at temperatures between 700 and 800 K by means of molecular dynamics simulation. Preliminary results indicated considerable structure dependence and yielded an activation energy for vacancy migration of 0.38 eV. In contrast to a previous study of vacancy migration in a bcc tilt boundary, thermal activation of a boundary interstitial by Frenkel pair production was not observed. © 1984.
Joy Y. Cheng, Daniel P. Sanders, et al.
SPIE Advanced Lithography 2008
J.H. Stathis, R. Bolam, et al.
INFOS 2005
John G. Long, Peter C. Searson, et al.
JES
J.K. Gimzewski, T.A. Jung, et al.
Surface Science