R.M. Macfarlane, R.L. Cone
Physical Review B - CMMP
The history and evolution of electron beam based contactless multichip module (MCM) test technology at IBM is described. The feasibility of a new contactless test method based on opens and shorts detection by means of the measurement of net capacitance is demonstrated. A case is given for the economic viability of a tester based on this technique.
R.M. Macfarlane, R.L. Cone
Physical Review B - CMMP
E. Babich, J. Paraszczak, et al.
Microelectronic Engineering
Sharee J. McNab, Richard J. Blaikie
Materials Research Society Symposium - Proceedings
Julien Autebert, Aditya Kashyap, et al.
Langmuir