ReviewElectromigration and reliability in submicron metallization and multilevel interconnectionThomas KwokMaterials Chemistry and Physics
PaperEvidence for vacancy mechanism in grain boundary diffusion in bcc iron: A molecular-dynamics studyThomas Kwok, P.S. Ho, et al.Physical Review Letters
PaperComputer simulation of vacancy migration in a fcc tilt boundaryThomas Kwok, Paul S. Ho, et al.Surface Science
Workshop paperAn enterprise electronic contract management system using dual XML and secure PDF documentsThomas Kwok, Thao NguyenEDOC 2006