M.M. Frank, V.K. Paruchuri, et al.
VLSI-TSA 2005
The authors have examined the role of sub nanometer La2 O3 and LaN cap layers interposed in SiHf O2 TiN high- k gate dielectric stacks in tuning the flatband and threshold voltages of capacitors and transistors. High performance, band edge n metal oxide field effect transistors with channel lengths down to 60 nm may be fabricated without significant compromise in mobility, electrical thickness, and threshold voltage. They have carried out a microstructural evaluation of these stacks and correlated these results with the electrical behavior of the devices. © 2007 American Institute of Physics.
M.M. Frank, V.K. Paruchuri, et al.
VLSI-TSA 2005
M. Copel, R.P. Pezzi, et al.
Applied Physics Letters
E. Gusev, M. Copel, et al.
Applied Physics Letters
E. Cartier, F.R. McFeely, et al.
VLSI Technology 2005