Lawrence Suchow, Norman R. Stemple
JES
Conference paper
Faster IC analysis with PICA spatial temporal photon correlation and CAD autochanneling
Abstract
To reduce PICA (Picosecond Imaging Circuit Analysis) acquisition time, we have developed a Spatial Temporal Photon Correlation approach (STPC-3D). Using a reduced CAD layout, the area where light emission may be detected is calculated in the CAD autochanneling process. Acquisition time is cut down from hours to minutes. A case study highlighting the significant time reduction for fault localization with PICA is presented in the document. © 2003 Elsevier Ltd. All rights reserved.
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