William Hinsberg, Joy Cheng, et al.
SPIE Advanced Lithography 2010
Variations in highly scaled (LG = 9nm), undoped-channel FinFET performance, caused by statistical dopant fluctuations (SDFs) in the source/drain (S/D) gradient regions, are systematically investigated using 3-D atomistic device simulations. The impact of SDF on device design optimization is examined and simple design strategies are identified. Variation-tolerant design imposes stringent specifications for S/D lateral abruptness and gate-sidewall spacer thickness, and it poses a tradeoff between performance and variability for body thickness. © 2006 IEEE.
William Hinsberg, Joy Cheng, et al.
SPIE Advanced Lithography 2010
Arun Viswanathan, Nancy Feldman, et al.
IEEE Communications Magazine
Reena Elangovan, Shubham Jain, et al.
ACM TODAES
David A. Selby
IBM J. Res. Dev