A. Davidson, P. Santhanam
Physics Letters A
Paper
Flip-chip bonding with solder dipping
Abstract
We report a simple technique for making flip-chip contacts. The equipment required, in addition to a small-scale photoresist clean room, is a beaker of molten solder.
Related
A. Davidson, N.F. Pedersen
Physica D: Nonlinear Phenomena
A. Davidson, N.F. Pedersen
Physical Review A
J.R. Kirtley, S. Washburn, et al.
Physical Review Letters