Conference paper
Impact of Cu microstructure on electromigration reliability
C.-K. Hu, L. Gignac, et al.
IITC 2007
No abstract available.
C.-K. Hu, L. Gignac, et al.
IITC 2007
C.-K. Hu, L. Gignac, et al.
Applied Physics Letters
C.-K. Hu, D. Canaperi, et al.
IRPS 2004
C.-C. Yang, T. Spooner, et al.
IITC 2006