Conference paper
A Multiscale Workflow for Thermal Analysis of 3DI Chip Stacks
Max Bloomfield, Amogh Wasti, et al.
ITherm 2025
IBM Telum II is an 8 core 5.5 GHz microprocessor for the zNext system. Key capacity and performance improvements are achieved through enhancements to the core, AI accelerator, and the use of high-density SRAM cell to increase cache size. A new on-chip data processing unit is included with an initial use of IO acceleration. Telum II maintains high reliability and a power profile within 5% of the prior generation while simultaneously increasing frequency and increasing latch count by 40%.
Max Bloomfield, Amogh Wasti, et al.
ITherm 2025
Evaline Ju, Kelly Abuelsaad
KubeCon EU 2026
Nikoleta Iliakopoulou, Jovan Stojkovic, et al.
MICRO 2025
Ilias Iliadis
International Journal On Advances In Networks And Services