A. Nagarajan, S. Mukherjee, et al.
Journal of Applied Mechanics, Transactions ASME
We review some opto-electronic devices based on the III-V/SOI heterogeneous integration platform, including lasers, modulators, wavelength converters, and photo-detectors. All of them are critical components for future on-chip interconnect and optical network-on-chip. The footprints of such devices are kept small by employing micro-cavity based structures. We give an overview of the device performances. The advantages over the all-silicon based devices are also discussed. Copyright © 2010 American Scientific Publishers All rights reserved.
A. Nagarajan, S. Mukherjee, et al.
Journal of Applied Mechanics, Transactions ASME
Xikun Hu, Wenlin Liu, et al.
IEEE J-STARS
Sharee J. McNab, Richard J. Blaikie
Materials Research Society Symposium - Proceedings
T.N. Morgan
Semiconductor Science and Technology