Conference paper
Copper-filled through wafer vias with very low inductance
Keith A. Jenkins, Chirag S. Patel
IITC 2005
The measurement of power supply noise and current by electron-beam probing is described. Noise measurements can be made on the chip under test, and current measurements can be made on the circuit board. © 1992 IEEE
Keith A. Jenkins, Chirag S. Patel
IITC 2005
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IEEE Journal of Solid-State Circuits
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IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
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IEEE TCAS-II