Haizhou Yin, M. Hamaguchi, et al.
VLSI-TSA 2008
A pronounced enhancement in the electrical activation of implanted Si in GaAs is demonstrated by co-implantation of Al. The maximum enhancement (×2) occurs when the Si distribution is shallow, there is a separation between the Si and Al distributions with the Al being deeper, the Si and Al are implanted at doses of ≤1×1013 cm-2, and subsequent annealing of the co-implanted GaAs is performed under capless or proximity cap conditions. A model considering gettering of the oxygen present in the bulk Czochralski-grown GaAs to the implanted Al is invoked to explain the observed activation enhancement.
Haizhou Yin, M. Hamaguchi, et al.
VLSI-TSA 2008
A. Ajmera, J. Sleight, et al.
VLSI Technology 1999
Yanning Sun, E.W. Kiewra, et al.
DRC 2008
Yanning Sun, S.J. Koester, et al.
CS MANTECH 2007