Conference paper
Pushing ASIC performance in a power envelope
Ruchir Puri, Leon Stok, et al.
DAC 2003
Given the exponential increase of fabrication costs, the global recession and credit crunch, one may ask if Moore's Law is financially viable beyond 22nm node. Can we justify the return-of-investment (ROI) for continuous scaling beyond 22nm? Shall we consider other alternatives for integration, such as silicon-in-a-package (SiP) or 3D integrations? Copyright 2009 ACM.
Ruchir Puri, Leon Stok, et al.
DAC 2003
Ohad Shamir, Sivan Sabato, et al.
Theoretical Computer Science
Indranil R. Bardhan, Sugato Bagchi, et al.
JMIS
Ruixiong Tian, Zhe Xiang, et al.
Qinghua Daxue Xuebao/Journal of Tsinghua University