Prediction of thermoset viscosity using a thermomechanical analyzer

A thermomechanical analyzer (TMA) in the parallel‐plate configuration was employed to study the viscosity behavior of an unfilled, FR‐4 type epoxy resin by monitoring its thickness change with time under a constant compressive force at various temperatures. With a dual‐Arrhenius reheology model, we were able to predict viscosities under nonisothermal conditions of high heating rate from more easily obtained isothermal viscosity data. Due to its simplicity and speed, this technique is well suited for investigating resin viscosity behavior during composite lamination in a manufacturing environment. Copyright © 1986 John Wiley & Sons, Inc.