Hendrik F. Hamann, Alan Weger, et al.
IEEE Journal of Solid-State Circuits
Paper
Rapid three-dimensional thermal characterization of large-scale computing facilities
Abstract
We demonstrate a mobile measurement technology which allows for fast and systematic 3-D temperature mapping of data centers. This technology yields the first experimental 3-D temperature images of an actual data center. The experimental temperature distributions reveal strong hot spots in the data center suggesting that current cooling schemes can be readily improved. © 2008 IEEE.
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