J.M.E. Harper, D.A. Smith, et al.
MRS Symposium 1985
Paper
Reduction of ion sputtering yield by special surface microtopography
Abstract
It is demonstrated that by covering a tungsten surface with tungsten needles, the sputtering coefficient for He ions is reduced by a factor of 3 to 100. Also, this metal surface does not blister under He bombardment to doses of 2.8×1019 He/cm2, although a similar polished W surface blisters at 1/30 this dose. Sputtering yields have been determined for both monoenergetic and distributed energy He ion beams, and the angular distribution of sputtered ions is reported.
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