G.A. Held, J.L. Jordan-Sweet, et al.
Solid State Communications
The minimum epitaxial layer thickness required to produce relaxed, thermally stable, Si0.7Ge0.3 buffer layer structures for high electron- and hole-mobility devices has been determined, using high resolution x-ray diffraction. A 1.4-μm-thick layer, step graded to x=0.35, is sufficiently thick so that the residual strain in a uniform composition Si 0.33Ge0.67 layer grown on top of it is essentially independent of thickness or growth temperature of the layer. Such structures are stable when annealed at 750°C.© 1995 American Institute of Physics.
G.A. Held, J.L. Jordan-Sweet, et al.
Solid State Communications
S.J. Koester, B.-U. Klepser, et al.
DRC 1998
C. Van Bockstael, K. De Keyser, et al.
Applied Physics Letters
L. Clevenger, C. Cabral Jr., et al.
Thin Solid Films