K. Ismail, B.S. Meyerson
Journal of Materials Science: Materials in Electronics
The minimum epitaxial layer thickness required to produce relaxed, thermally stable, Si0.7Ge0.3 buffer layer structures for high electron- and hole-mobility devices has been determined, using high resolution x-ray diffraction. A 1.4-μm-thick layer, step graded to x=0.35, is sufficiently thick so that the residual strain in a uniform composition Si 0.33Ge0.67 layer grown on top of it is essentially independent of thickness or growth temperature of the layer. Such structures are stable when annealed at 750°C.© 1995 American Institute of Physics.
K. Ismail, B.S. Meyerson
Journal of Materials Science: Materials in Electronics
N. Caswell, P.M. Mooney, et al.
Applied Physics Letters
P.M. Mooney, K. Rim, et al.
Solid-State Electronics
C. Lavoie, C. Cabral Jr., et al.
MRS Fall Meeting 1995