Scripta Metallurgica et Materiala
Paper
15 Jun 1994

Segregation of copper in dilute aluminum - copper alloys

View publication

Abstract

No abstract available.

Related

Paper

The development of grain structure during growth of metallic films

C.R.M. Grovenor, H.T.G. Hentzell, et al.

Acta Metallurgica

Paper

Growth and dissolution kinetics of ternary III-V heterostructures formed by liquid phase epitaxy. III. Effects of temperature programming

R. Ghez, M.B. Small

Journal of Applied Physics

Paper

Selection of solutes for improving electromigration resistance of metals: A new insight

M.B. Small, D.A. Smith

Applied Physics Letters

Paper

low Temperature Silicon Epitaxy by Hot Wall Ultrahigh Vacuum/Low Pressure Chemical Vapor Deposition Techniques: Surface Optimization

B.S. Meyerson, E. Ganin, et al.

JES

View all publications
  1. Home
  2. ↳ Publications

Date

15 Jun 1994

Publication

Scripta Metallurgica et Materiala

Authors

  • M.B. Small
  • D.A. Smith
  • A.J. Garratt-Reed
IBM-affiliated at time of publication

Resources

  • Publication

Share