O.F. Schirmer, K.W. Blazey, et al.
Physical Review B
The initial stage of the thermal oxidation of various crystallographic orientations of silicon ((100), (110), and (111) orientations) reveals a complex rate behavior. This behavior is not understood within the conventional linear-parabolic model. A recently revised model which explicitly contains the areal density of Si atoms and mechanical stress effects is shown to provide both a qualitative (for all orientations studied) and somewhat quantitative (for (110) and (111) orientations) explanation of the complex substrate orientation effects. © 1986, The Electrochemical Society, Inc. All rights reserved.
O.F. Schirmer, K.W. Blazey, et al.
Physical Review B
H.D. Dulman, R.H. Pantell, et al.
Physical Review B
David B. Mitzi
Journal of Materials Chemistry
William G. Van der Sluys, Alfred P. Sattelberger, et al.
Polyhedron