S. Cohen, J.C. Liu, et al.
MRS Spring Meeting 1999
The initial stage of the thermal oxidation of various crystallographic orientations of silicon ((100), (110), and (111) orientations) reveals a complex rate behavior. This behavior is not understood within the conventional linear-parabolic model. A recently revised model which explicitly contains the areal density of Si atoms and mechanical stress effects is shown to provide both a qualitative (for all orientations studied) and somewhat quantitative (for (110) and (111) orientations) explanation of the complex substrate orientation effects. © 1986, The Electrochemical Society, Inc. All rights reserved.
S. Cohen, J.C. Liu, et al.
MRS Spring Meeting 1999
G. Will, N. Masciocchi, et al.
Zeitschrift fur Kristallographie - New Crystal Structures
B.A. Hutchins, T.N. Rhodin, et al.
Surface Science
E. Babich, J. Paraszczak, et al.
Microelectronic Engineering