DIFFUSION BARRIER STUDIES FOR Cu.
C.-K. Hu, S. Chang, et al.
VMIC 1985
Decomposition of SiO2 films on Si(100) during ultrahigh-vacuum anneal has been shown previously to be preceded, at low anneal temperatures, by electrical defect creation in metal-oxide-semiconductor structures. In this letter, the presence of stacking faults in a Si substrate is shown to be related to enhanced oxide decomposition during high-temperature anneal. Decomposition is enhanced because of the creation of a larger number of nucleation centers for the formation of volatile SiO. These nucleation centers are the result of the metals gettered in the stacking faults close to the SiO2/Si interface.
C.-K. Hu, S. Chang, et al.
VMIC 1985
M. Liehr, F.K. LeGoues, et al.
JVSTA
S.L. Cohen, D.L. Rath, et al.
MRS Spring Meeting 1995
G.W. Rubloff, K. Hofmann, et al.
Physical Review Letters