Anand Ramalingam, Frank Liu, et al.
ISQED 2006
In this brief, a temperature-and variation-aware electromigration analysis (T-VEMA) tool for power grid wires is described. First, T-VEMA performs a two-stage interconnect thermal analysis on a full chip. Next, the tool extracts the effective jL product values and performs an electromigration (EM) lifetime calculation on ideally manufactured mortal wires on the basis of thermal effects. Finally, T-VEMA analyzes process variation effects on EM reliability at global and local levels and reports variation tolerances of EM-sensitive power grid wires.
Anand Ramalingam, Frank Liu, et al.
ISQED 2006
Ulf Schlichtmann, Veit B. Kleeberger, et al.
DATE 2014
Hailin Jiang, Malgorzata Marek-Sadowska, et al.
ICCD 2005
Joseph N. Kozhaya, Sani R. Nassif, et al.
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems