O.F. Schirmer, W. Berlinger, et al.
Solid State Communications
Paper
The study of polyimide films and adhesion using a surface acoustic wave sensor
Abstract
A dual delay line surface acoustic wave (SAW) sensor on an ST-quartz substrate has been used to study water uptake and downtake and its effect on adhesion in both cured and uncured polyimide films. Film samples both with and without adhesion promoter have been studied. The experimental results suggest the possibility of using a SAW sensor as a cure indicator, humidity sensor or adhesion sensor. © 1991.
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