L. Krusin-Elbaum, T. Shibauchi, et al.
Journal of Magnetism and Magnetic Materials
The thermal stability of polycrystalline silicon/metal oxide interfaces was investigated by using transmission electron microscopy (TEM). TEM showed strong reactions at the poly-Si/metal oxide interface when annealed at 1000°C. It was found that the thermal stability of polycrystalline silicon/metal oxide interface was significantly enhanced when the poly-Si was plasma deposited using silane diluted in He.
L. Krusin-Elbaum, T. Shibauchi, et al.
Journal of Magnetism and Magnetic Materials
S. Zafar, Y.-H. Kim, et al.
VLSI Technology 2006
E. Gusev, D.A. Buchanan, et al.
Technical Digest - International Electron Devices Meeting
K. Choi, H. Jagannathan, et al.
VLSI Technology 2009