L. Krusin-Elbaum, J.R. Thompson, et al.
Applied Physics Letters
We report a first observation of the remarkably low electrical resistivity of copper germanide thin films formed at temperatures below 200°C. At these low temperatures, the ε-Cu3Ge phase with a monoclinic crystal structure is formed, with room-temperature resistivity which can be as low as 5.5 μΩ cm. The films are electrically stable up to at least 600°C, and, unlike pure copper, are also stable against oxygen and air exposure.
L. Krusin-Elbaum, J.R. Thompson, et al.
Applied Physics Letters
L. Krusin-Elbaum, M. Wittmer
Thin Solid Films
L. Krusin-Elbaum, A.D. Marwick, et al.
Czechoslovak Journal of Physics
K.N. Chen, C. Cabral Jr., et al.
Microelectronic Engineering