Journal of the IEICE

Paper

01 Aug 2015

Wafer bumping technologies

Conference paper

Fine pitch bumping and flip chip joining with Sn-BI based solders by injection molded solder technology

Toyohiro Aoki, Katsuhiro Yoshida, et al.

ICEP 2021

Conference paper

Scaling challenges of semiconductor packaging in the era of big data

Yasumitsu Orii, Akihiro Horibe, et al.

IMAPS 2013

Paper

Full intermetallic joints for chip stacking by using thermal gradient bonding

T.L. Yang, Toyohiro Aoki, et al.

Acta Materialia

Conference paper

Novel Low Cost Bumping Process with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS) for Fine Pitch Flip Chip Joining

Toyohiro Aoki, Takashi Hisada, et al.

ECTC 2016

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