Journal of the IEICE

Paper

01 Aug 2015

Wafer bumping technologies

Conference paper

Advanced interconnect technologies in the era of cognitive computing

Yasumitsu Orii, Akihiro Horibe, et al.

Pan Pacific 2016

Paper

Full intermetallic joints for chip stacking by using thermal gradient bonding

T.L. Yang, Toyohiro Aoki, et al.

Acta Materialia

Conference paper

Solder and Organic Adhesive Hybrid Bonding Technology with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS)

Keiji Matsumoto, Takahito Watanabe, et al.

ECTC 2022

Conference paper

Heterogeneous Integration on Organic Interposer Substrate with fine-pitch RDL and 40 micron pitch Micro-bumps

Katsuyuki Sakuma, Griselda Bonilla, et al.

ECTC 2023

View all publications