Journal of the IEICE

Paper

01 Aug 2015

Wafer bumping technologies

Paper

Simulation and Experimental study on IMS (Injection Molded Solder) bumping with expanded resist patterning for reinforcement of fine-pitch capability

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Advancing Microelectronics

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Solder Injected through Via for Multi Stacked Wafers

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ECTC 2016

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Scaling challenges of semiconductor packaging in the era of big data

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IMAPS 2013

Conference paper

Effect of Interfacial Wetting on First Level Interconnect Joint Formation For Low Temperature Solders-iNEMI Project

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ICEP-IAAC 2025

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