Ta as a barrier for the Cu/PtSi, Cu/Si, and Al/PtSi structures
- Chin-An Chang
- 1990
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Paper
Publications
119 results for Chin-An Chang
Novel method of patterning YBaCuO superconducting thin films
- Q.Y. Ma
- E.S. Yang
- et al.
- 1989
- Applied Physics Letters
PaperThermal stability of the Cu/Pd/Si metallurgy
- Chin-An Chang
- 1989
- Applied Physics Letters
PaperCarbon as a barrier for the outdiffusion of Cu
- Chin-An Chang
- D.S. Yee
- et al.
- 1989
- Applied Physics Letters
PaperFormation of palladium silicide in the presence of Al with and without a carbon barrier layer
- Chin-An Chang
- 1989
- Applied Physics Letters
PaperOutdiffusion of Cu through Au: Comparison of (100) and (111) Cu films epitaxially deposited on Si, and effects of annealing ambients
- Chin-An Chang
- 1989
- Applied Physics Letters
PaperRapid thermal annealing of YBaCuO thin films deposited on SiO2 substrates
- Q.Y. Ma
- E.S. Yang
- et al.
- 1989
- Journal of Applied Physics
PaperReduced Al/PtSi reaction up to 600°C using an amorphous carbon barrier layer
- Chin-An Chang
- 1989
- Journal of Applied Physics
PaperInterdiffusion between Si substrates and YBaCuO films
- Q.Y. Ma
- X. Wu
- et al.
- 1989
- Physica C: Superconductivity and its applications
PaperHigh-temperature interaction studies of C/Cu/SiO2/Si and related structures
- Chin-An Chang
- 1989
- Journal of Applied Physics
Paper