Summary Abstract: A Quantitative Ion Beam Process Applied to the Deposition of Aluminum Nitride Thin Films
- J.M.E. Harper
- H.T.G. Hentzell
- et al.
- 1984
- JVSTA
Paper
Publications
18 results for H.T.G. Hentzell
The development of grain structure during growth of metallic films
- C.R.M. Grovenor
- H.T.G. Hentzell
- et al.
- 1984
- Acta Metallurgica
PaperInterdiffusion in copper-aluminum thin film bilayers. I. Structure and kinetics of sequential compound formation
- H.T.G. Hentzell
- R.D. Thompson
- et al.
- 1983
- Journal of Applied Physics
PaperQuantitative ion beam process for the deposition of compound thin films
- J.M.E. Harper
- J.J. Cuomo
- et al.
- 1983
- Applied Physics Letters
PaperInterdiffusion in copper-aluminum thin film bilayers. II. Analysis of marker motion during sequential compound formation
- H.T.G. Hentzell
- K.N. Tu
- 1983
- Journal of Applied Physics
PaperSummary Abstract: Crystallographic structure of coevaporated Ni-Al alloy films
- H.T.G. Hentzell
- B. Andersson
- et al.
- 1983
- JVSTA
PaperGrain size and growth of Ni-Rich Ni-Al alloy films
- H.T.G. Hentzell
- B. Andersson
- et al.
- 1983
- Acta Metallurgica
PaperMotion of W marker during sequential compound formation in bimetallic AlCu thin films
- H.T.G. Hentzell
- R.D. Thompson
- et al.
- 1983
- Materials Letters
Paper