Critical factors affecting the undercooling of Pb-free, flip-chip solder bumps and in-situ observation of solidification process
- Sung K. Kang
- Moon Gi Cho
- et al.
- 2007
- ECTC 2007
Conference paper
Publications
67 results for D.Y. Shih
Effects of minor additions of Zn on interfacial reactions of Sn-Ag-Cu and Sn-Cu solders with various Cu substrates during thermal aging
- Moon Gi Cho
- Sung K. Kang
- et al.
- 2007
- Journal of Electronic Materials
PaperStudy of the undercooling of Pb-free, flip-chip solder bumps and in situ observation of solidification process
- Sung K. Kang
- M.G. Cho
- et al.
- 2007
- Journal of Materials Research
PaperThe influence of low level doping on the thermal evolution of SAC alloy solder joints with Cu pad structures
- Isabel De Sousa
- Donald W. Henderson
- et al.
- 2006
- ECTC 2006
Conference paperInterfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition
- Sung K. Kang
- Donovan Leonard
- et al.
- 2006
- Journal of Electronic Materials
PaperEffect of intermetallics spalling on the mechanical behavior of electroless Ni(P)/Pb-free solder interconnection
- Yoon-Chul Sohn
- Jin Yu
- et al.
- 2005
- ECTC 2005
Conference paperThe oxidation of lead-free Sn alloys by electrochemical reduction analysis
- Sungil Cho
- Jin Yu
- et al.
- 2005
- JOM
PaperMicrostructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications
- Sung K. Kang
- Paul A. Lauro
- et al.
- 2005
- IBM J. Res. Dev
PaperLow-cost wafer bumping
- Peter A. Gruber
- Luc Bélanger
- et al.
- 2005
- IBM J. Res. Dev
ReviewEvaluation of thermal fatigue life and failure mechanisms of Sn-Ag-Cu solder joints with reduced Ag contents
- Sung K. Kang
- Paul Lauro
- et al.
- 2004
- ECTC 2004
Conference paper