Hardness, friction and wear of multiplated electrical contacts
- Peter A. Engel
- Eugene Y. Hsue
- et al.
- 1993
- Wear
Paper
Publications
4 results for P.A. Engel
Thermal stress analysis of pin grid array structures: Module and card interactions
- P.A. Engel
- J.R. Webb
- 1992
- ASME Journal of Electronic Packaging
PaperSliding failure model for magnetic head-disk interface
- P.A. Engel
- B. Bhushan
- 1990
- Journal of Tribology
PaperMechanical analysis for thermal grease enhanced modules enclosing a silicon chip
- P.A. Engel
- D.H. stmpe
- et al.
- 1989
- ASME Journal of Electronic Packaging
Paper