Adhesion test standardization for multichip module packages
- D.Y. Shih
- J. Kim
- et al.
- 1995
- ECTC 1995
Conference paper
Publications
3 results for R.H. Lacombe
Comparison of finite element stress analysis results with peel strength at the copper-polyimide interface
- R.H. Lacombe
- L.P. Buchwalter
- et al.
- 1993
- Journal of Adhesion Science and Technology
PaperAdhesion of polyimide to fluorine-contaminated Si02 surface. Effect of aminopropyltriethoxysilane on the adhesion
- L.P. Buchwalter
- R.H. Lacombe
- 1991
- Journal of Adhesion Science and Technology
Paper