Thermocompression bonding of aluminum bumps in TAB applications
- Sung K. Kang
- 1998
- ECTC 1998
Conference paper
Publications
3 results for Sung K. Kang
Gold-to-aluminum bonding for TAB applications
- Sung K. Kang
- 1992
- ECTC 1992
Conference paperGold-to-Aluminum Bonding for TAB Applications
- Sung K. Kang
- 1992
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Paper