Topology Optimization for Embedded Cooling of Multiple and Transient Workloads in 3D Semiconductor PackagesZekun WuAshwin Kidambiet al.2025ITherm 2025Conference paper
Reduced Physics Modeling of Two-Phase Flow through High-Density Cooling StructuresPritish ParidaShurong Tianet al.2024ITherm 2024Conference paper
Systems Two Phase CoolingTimothy ChainerLiz Hulihanet al.2023ARPA-E COOLERCHIPS Kickoff Meeting 2023Invited talk