Thermal cycle reliability of stacked via structures with copper metallization and an organic low-k dielectric
- R. Filippi
- J.F. McGrath
- et al.
- 2004
- IRPS 2004
Conference paper
Publications
19 results for C.R. Davis
A high performance 0.13 μm copper BEOL technology with low-k dielectric
- R.D. Goldblatt
- B.N. Agarwala
- et al.
- 2000
- IITC 2000
Conference paperCrystallization behavior and mechanical properties of a nylon-6, -6/6, and -12 terpolyamide
- Charles R. Davis
- 1996
- Journal of Applied Polymer Science
PaperCrystallization behavior and mechanical properties of a nylon-6, -6/6, and -12 terpolyamide
- C.R. Davis
- 1996
- Journal of Applied Polymer Science
PaperCrystalline Homopolymer-Copolymer Blends: Poly(tetrafluoroethylene)-Poly(tetrafluoroethylene-co-perfluoroalkylvinyl ether)
- J. Runt
- L. Jin
- et al.
- 1995
- Macromolecules
PaperStructural-modification mechanism for polyimide-doped poly(tetrafluoroethylene) at subthreshold fluences using 248 nm radiation
- C.R. Davis
- R.W. Snyder
- et al.
- 1994
- Journal of Applied Physics
PaperIntegrated flex: Rigid-flex capability in a high performance MCM
- David N. Light
- John S. Kresge
- et al.
- 1994
- MCMC 1994
Conference paperThermal stability studies of a polyimide–polytetrafluoroethylene blend and its components
- Charles R. Davis
- Jeffrey A. Zimmerman
- 1994
- Journal of Applied Polymer Science
PaperDopant-induced excimer laser ablation of Poly(tetrafluoroethylene)
- C.R. Davis
- F.D. Egitto
- et al.
- 1992
- Applied Physics B Photophysics and Laser Chemistry
Paper