Publications

5 results for Oluwafemi Ogunsola

UV curing-induced photoresist poisoning in advanced ULK BEOL integration schemes
- - Y.C. Ee
  - D. Kioussis
  - et al.
- 2009
- ADMETA 2009
Conference paper
CoWP metal caps for reliable 32 nm 1X Cu interconnects in porous ULK (k=2.4)
- - E. Huang
  - M. Oh
  - et al.
- 2009
- ADMETA 2009
Conference paper
Effect of TaN stoichiometry on barrier oxidation and defect density in 32nm Cu/ultra-low K interconnects
- - Andrew H. Simon
  - Frieder Baumann
  - et al.
- 2010
- MRS Online Proceedings Library
Conference paper
High performance 32nm SOI CMOS with high-k/metal gate and 0.149μm ² SRAM and ultra low-k back end with eleven levels of copper
- - B. Greene
  - Q. Liang
  - et al.
- 2009
- VLSI Technology 2009
Conference paper
'Trimodal' wafer-level package: Fully compatible electrical, optical, and fluidic chip I/O interconnects
- - Muhannad S. Bakir
  - Bing Dang
  - et al.
- 2007
- ECTC 2007
Conference paper