Publications

2 results for Seshadri K. Kolluri

Fast 3-D thermal analysis of complex interconnect structures using electrical modeling and simulation methodologies
- - Chuan Xu
  - Lijun Jiang
  - et al.
- 2009
- ICCAD 2009
Conference paper
Thermal modeling of on-chip interconnects and 3D packaging using EM tools
- - Lijun Jiang
  - Seshadri Kolluri
  - et al.
- 2008
- EPEPS 2008
Conference paper