Evaluation of device damage from e-beam curing of ultra low-k BEOL dielectrics
- S. Mehta
- C. Dimitrakopoulos
- et al.
- 2005
- AMC 2005
Conference paper
Publications
6 results for D. Harmon
Determination of the thermal conductivity of composite low-k dielectrics for advanced interconnect structures
- F. Chen
- J. Gill
- et al.
- 2006
- Microelectronics Reliability
PaperHigh performance 65 nm SOI technology with enhanced transistor strain and advanced-low-K BEOL
- W.-H. Lee
- A. Waite
- et al.
- 2005
- IEDM 2005
Conference paperHigh performance 65 nm SOI technology with dual stress liner and low capacitance SRAM cell
- E. Leobandung
- H. Nayakama
- et al.
- 2005
- VLSI Technology 2005
Conference paperMeasurements of effective thermal conductivity for advanced interconnect structures with various composite low-K dielectrics
- F. Chen
- J. Gill
- et al.
- 2004
- IRPS 2004
Conference paperMeasurements of effective thermal conductivity for advanced interconnect structures with various composite low-k dielectrics
- F. Chen
- J. Gill
- et al.
- 2004
- IRPS 2004
Conference paper