Thermal cycle reliability of stacked via structures with copper metallization and an organic low-k dielectric
- R. Filippi
- J.F. McGrath
- et al.
- 2004
- IRPS 2004
Conference paper
Publications
27 results for Thomas Ivers
Comprehensive reliability evaluation of a 90 nm CMOS technology with Cu/PECVD low-k BEOL
- D. Edelstein
- H.S. Rathore
- et al.
- 2004
- IRPS 2004
Conference paperComprehensive reliability evaluation of a 90 nm CMOS technology with Cu/PECVD low-k BEOL
- D. Edelstein
- H.S. Rathore
- et al.
- 2004
- IRPS 2004
Conference paperThermal cycle reliability of stacked via structures with copper metallization and an organic low-k dielectric
- R. Filippi
- J.F. McGrath
- et al.
- 2004
- IRPS 2004
Conference paperIntegration of copper and fluorosilicate glass for 0.18 μm interconnections
- E. Barth
- T. Ivers
- et al.
- 2000
- IITC 2000
Conference paperCharacterization of thin dielectric films as copper diffusion barriers using triangular voltage sweep
- S. Cohen
- J.C. Liu
- et al.
- 1999
- MRS Spring Meeting 1999
PaperCharacterization of thin dielectric films as copper diffusion barriers using triangular voltage sweep
- S. Cohen
- J.C. Liu
- et al.
- 1999
- MRS Spring Meeting 1999
Conference paper