Reliability, yield, and performance of a 90 nm SOI/Cu/SiCOH technology
- D. Edelstein
- C.R. Davis
- et al.
- 2004
- IITC 2004
Conference paper
Publications
14 results for A. Sakamoto
Integrated electro-chemical mechanical planarization (Ecmp) for future generation device technology
- L. Economikos
- X. Wang
- et al.
- 2004
- IITC 2004
Conference paperComprehensive reliability evaluation of a 90 nm CMOS technology with Cu/PECVD low-k BEOL
- D. Edelstein
- H.S. Rathore
- et al.
- 2004
- IRPS 2004
Conference paperComprehensive reliability evaluation of a 90 nm CMOS technology with Cu/PECVD low-k BEOL
- D. Edelstein
- H.S. Rathore
- et al.
- 2004
- IRPS 2004
Conference paper