Analysis and comparative evaluation of stacked-Transistor half-bridge topologies implemented with 14 nm bulk CMOS technology
- Pedro André Martins Bezerra
- R.K. Aljameh
- et al.
- 2017
- COMPEL 2017
Conference paper
Publications
30 results for Arvind Sridhar
Internet of the Body and Cognitive Hypervisor
- R. Strassle
- S. Gerke
- et al.
- 2017
- CHASE 2017
Conference paperThermal model for embedded two-phase liquid cooled microprocessor
- Pritish R. Parida
- Arvind Sridhar
- et al.
- 2017
- ITherm 2017
Conference paperModeling embedded two-phase liquid cooled high power 3D compatible electronic devices
- Pritish R. Parida
- Arvind Sridhar
- et al.
- 2017
- SEMI-THERM 2017
Conference paperScalable packaging platform supporting high-performance 3D chip stacks
- Thomas Brunschwiler
- Gerd Schlottig
- et al.
- 2017
- Pan Pacific 2017
Conference paperExploration of inductor-based hybrid integrated voltage regulator architectures
- Arvind Sridhar
- Thomas Brunschwiler
- et al.
- 2016
- ESTC 2016
Conference paperStudy of two-phase pressure drop and heat transfer in a micro-scale pin fin cavity: Part A
- Arvind Sridhar
- Ozgur Ozsun
- et al.
- 2016
- ITherm 2016
Conference paperStudy of two-phase pressure drop and heat transfer in a micro-scale pin fin cavity: Part B
- Pritish R. Parida
- Arvind Sridhar
- et al.
- 2016
- ITherm 2016
Conference paperBenchmarking study on the thermal management landscape for three-dimensional integrated circuits: From back-side to volumetric heat removal
- Thomas Brunschwiler
- Arvind Sridhar
- et al.
- 2016
- ASME Journal of Electronic Packaging
PaperICCAD 2015 contest in 3D interlayer cooling optimized network
- Arvind Sridhar
- Mohamed M. Sabry
- et al.
- 2015
- ICCAD 2015
Conference paper