Dual stress liner enhancement in hybrid orientation technology
- C. Sheraw
- M. Yang
- et al.
- 2005
- VLSI Technology 2005
Conference paper
Publications
27 results for Laertis Economikos
Integrated electro-chemical mechanical planarization (Ecmp) for future generation device technology
- L. Economikos
- X. Wang
- et al.
- 2004
- IITC 2004
Conference paper90 nm SiCOH technology in 300 mm manufacturing
- L. Clevenger
- M. Yoon
- et al.
- 2004
- ADMETA 2004
Conference paperA 90nm dual damascene hybrid (organic / inorganic) low-k - Copper BEOL integration scheme
- T. Dalton
- A. Cowley
- et al.
- 2003
- ADMETA 2003
Conference paperStructural demonstration of cost effective Isolation Trench fill for sub-110nm vertical trench DRAM and SOC applications
- S.-W. Yang
- W.-S. Liao
- et al.
- 2003
- VLSI-TSA 2003
Conference paperStudy of arsenic out-diffusion for buried plate formation in trench capacitors
- L. Economikos
- C.S. Murthy
- et al.
- 1998
- IEMT 1998
Conference paperApplications of latent open test
- Laertis Economikos
- Shinwu Chiang
- et al.
- 1994
- MCMC 1994
Conference paper