A porous SiCOH dielectric with k=2.4 for high performance BEOL interconnects
- S. Gates
- A. Grill
- et al.
- 2006
- ADMETA 2006
Conference paper
Publications
155 results for Alfred Grill
The effect of plasma chemistry on the damage induced to porous SiCOH dielectrics
- A. Grill
- V.V. Patel
- 2006
- JES
Paper65nm Cu integration and interconnect reliability in low stress K=2.75 SiCOH
- V. McGahay
- G. Bonilla
- et al.
- 2006
- IITC 2006
Conference paperPECVD Low-k (∼2.7) dielectric SiCOH film development and integration for 65 nm CMOS devices
- K. Ida
- S. Nguyen
- et al.
- 2005
- AMC 2005
Conference paperLow-k/copper integration scheme suitable for ULSI manufacturing from 90nm to 45nm nodes
- T. Nogami
- S. Lane
- et al.
- 2005
- Optics East 2005
Conference paperHigh-speed germanium-on-insulator photodetectors
- G. Dehlinger
- J. Schaub
- et al.
- 2005
- LEOS 2005
Conference paperGermanium-on-insulator photodetectors
- S.J. Koester
- G. Dehlinger
- et al.
- 2005
- GFP 2005
Conference paperLower-k SiCOH integration for 65 nm ground rules
- T. Nogami
- S. Lane
- et al.
- 2005
- VMIC 2005
Conference paperHydrogen plasma effects on ultralow-k porous SiCOH dielectrics
- A. Grill
- V. Sternhagen
- et al.
- 2005
- Journal of Applied Physics
PaperNanoindentation analysis of mechanical properties of low to ultralow dielectric constant SiCOH films
- Lugen Wang
- M. Ganor
- et al.
- 2005
- Journal of Materials Research
Paper