System-on-Package (SOP) technology, characterization and applications
- J. Knickerbocker
- P. Andry
- et al.
- 2006
- ECTC 2006
Conference paper
Publications
44 results for Bucknell Webb
Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection
- John U. Knickerbocker
- Paul S. Andry
- et al.
- 2005
- IBM J. Res. Dev
PaperAdvanced write heads for high density and high data rate recording
- Samuel W. Yuan
- E. Lee
- et al.
- 2002
- IEEE Transactions on Magnetics
PaperA self-servowrite clocking process
- M.D. Schultz
- E.J. Yarmchuk
- et al.
- 2001
- IEEE Transactions on Magnetics
PaperHigh field, high frequency magnetic dynamics of narrow thin-film magnetic multilayer stripes
- Bucknell C. Webb
- Mark E. Re
- et al.
- 1992
- Journal of Magnetism and Magnetic Materials
PaperMagnetic and structural characterization of sputtered FeN multilayer films
- Michael A. Russak
- Christopher V. Jahnes
- et al.
- 1992
- Journal of Magnetism and Magnetic Materials
PaperSimple Model Of The High Frequency Permeability Of Narrow Thin-Film Structures With Eddy Currents, Walls, And Saturation
- Bucknell C. Webb
- Mark E. Re
- et al.
- 1992
- IEEE Transactions on Magnetics
PaperMagnetic and structural characterization of sputtered FeN multilayer films
- Michael A. Russak
- Christopher V. Jahnes
- et al.
- 1991
- Journal of Applied Physics
PaperHigh-frequency permeability of laminated and unlaminated, narrow, thin-film magnetic stripes (invited)
- Bucknell C. Webb
- Mark E. Re
- et al.
- 1991
- Journal of Applied Physics
PaperThe High Field, High Frequency Permeability of Narrow, Thin-Film Magnetic Stripes
- Bucknell C. Webb
- Mark E. Re
- et al.
- 1991
- IEEE Transactions on Magnetics
Paper