Publications

2 results for J. Benedict

Mechanisms of Electromigration Damage in Cu Interconnects
- - C. K. Hu‬
  - Lynne Gignac
  - et al.
- 2018
- IEDM 2018
Conference paper
Future on-chip interconnect metallization and electromigration
- - C. K. Hu‬
  - James Kelly
  - et al.
- 2018
- IRPS 2018
Conference paper