Publications

2 results for Kai Chen

Electromigration study in flip chip solder joints
- - Jae-Woong Nah
  - Kai Chen
  - et al.
- 2007
- ECTC 2007
Conference paper
Mechanism of electromigration-induced failure in flip-chip solder joints with a 10-μm-thick Cu under-bump metallization
- - Jae-Woong Nah
  - Kai Chen
  - et al.
- 2007
- Journal of Materials Research
Paper