Publications

5 results for S. Goma

Critical aspects of layer transfer and alignment tolerances for 3D integration processes
- - D.C. La Tulipe
  - L.T. Shi
  - et al.
- 2006
- GBC 2006
Conference paper
Enabling SOI-based assembly technology for three-dimensional (3D) integrated circuits (ICs)
- - A. Topol
  - D.C. La Tulipe
  - et al.
- 2005
- IEDM 2005
Conference paper
Assembly technology for three dimensional integrated circuits
- - A. Topol
  - D.C. La Tulipe
  - et al.
- 2005
- VMIC 2005
Conference paper
Electron and hole mobility enhancement in strained SOI by wafer bonding
- - Lijuan Huang
  - Jack O. Chu
  - et al.
- 2002
- IEEE Transactions on Electron Devices
Paper
Carrier mobility enhancement in strained Si-On-Insulator fabricated by wafer bonding
- - L.J. Huang
  - J.O. Chu
  - et al.
- 2001
- VLSI Technology 2001
Conference paper